Launching Its First Official Japan Event “XRP Tokyo 2026” at Happo-en, Tokyo
Tokyo, Japan — November 2025 — TEAMZ Inc. announced that XRP will serve as the Title Sponsor of TEAMZ Web3/AI Summit 2026, to be held on April 7–8, 2026, at Happo-en, Tokyo. XRP will also host its first official Japan event, “XRP Tokyo 2026,” on April 7 at the main building of Happo-en (5th and 6th floors).
About XRP Tokyo 2026
Hosted by the XRPL Japan Association, XRP Tokyo 2026 will focus exclusively on the XRP Ledger ecosystem, connecting builders, investors, and enterprises exploring tokenization, payments, DeFi, and NFTs.
Event Details
- Event Name: XRP Tokyo 2026
- Date: April 7, 2026
- Venue: Happo-en Main Building 5F (Speaker Stage) & 6F (Networking & Booth Area)
- Host: XRPL Japan Association
- Admission: Invitation or Summit participants only.
Significance of the Partnership
The TEAMZ Web3/AI Summit is Japan’s largest Web3 and AI business conference, bringing together more than 10,000 attendees annually. With XRP as Title Sponsor, this partnership will strengthen ties between the global XRPL community and Japan’s Web3 ecosystem, advancing collaboration between finance, regulation, and technology.
Comment from TEAMZ CEO, Tianyu Yang
“We are honored to welcome XRP as the Title Sponsor of TEAMZ Summit 2026. The growth of the XRPL community in Japan is remarkable, and we believe ‘XRP Tokyo 2026’ will become a landmark event representing the next wave of blockchain innovation from Japan to the world.”
Media Contact
- TEAMZ Inc.
- Public Relations: Michi
- E-mail: michim@teamz.co.jp
- Website: https://www.teamz.co.jp
